File:IBM Broadway B with heat spreader.jpg

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English: An illustration of IBM's processor for Nintendo's Wii, called Broadway. This is the third variant, manufactured on a 90 nm copper SOI process in week 5 of 2008 mounted on a organic ball grid array substrate, with a heat spreader on it. Inspiration for the image comes from numerous pictures on the Internet, IBM, Nintendo and privately owned photos.
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Author Henriok

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The person who associated a work with this deed has dedicated the work to the public domain by waiving all of their rights to the work worldwide under copyright law, including all related and neighboring rights, to the extent allowed by law. You can copy, modify, distribute and perform the work, even for commercial purposes, all without asking permission.

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22 July 2015

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current15:33, 22 July 2015Thumbnail for version as of 15:33, 22 July 20151,488 × 1,488 (722 KB)HenriokUser created page with UploadWizard

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