Talk:Three-dimensional integrated circuit

Simulators

IntSim is an open-source CAD tool to simulate 2D and 3D-ICs.
Download the simulator here


The first version of this CAD tool, IntSim v1.0, was developed in 2007 by Deepak Sekar, our Chief Scientist, during his Ph.D. with Prof. James Meindl at Georgia Tech. IntSim v1.0 is a MATLAB-based 2D-IC simulator used by many universities and researchers today. This ICCAD 2007 paper describes IntSim v1.0. As you will see from the paper, several generations of students at Georgia Tech contributed to IntSim v1.0's models and algorithms. This includes Deepak Sekar, Raguraman Venkatesan, Jeffrey Davis, Reza Sarvari, Kaveh Shakeri, Keith Bowman, Qiang Chen and Azad Naeemi, all of whom did their graduate studies in Prof. James Meindl's group.

IntSim v2.5 adds a sophisticated new Graphical-User-Interface (GUI) to the CAD tool. The GUI now:
-Allows the ability to store and load technology files,
-Runs simulations for multiple parameter values to optimize them, and
-Provides a more pleasing experience to the user with several additional features A video showing a demo of IntSim v2.5 is available to view here.



— Preceding unsigned comment added by Iulia2020 (talk • contribs) 08:57, 23 September 2011 (UTC)

3D IC Technology - News, Papers and Blogs

3D chips are seen as an important growth area for the semiconductor industry. An analyst firm, recently projected that the market for 3D Through-Silicon Via (TSV) packaging will increase from $325M in 2009 to $4.1B in 2015, a cumulative annual growth rate (CAGR) of 53%. This compares with a projected CAGR of 7.7% for the overall semiconductor packaging industry. In addition, players in the memory industry, such as Toshiba, Samsung, Micron and Hynix, are actively exploring monolithic 3D approaches to NAND flash memory, with risk production scheduled to begin in the next 3 years. Interest in the field is high due to these reasons.
3D-ICs Community is a social group founded for 3D Integrated Circuit (3D-IC) technology. It represents a website that gathers the latest news, blog pieces and papers on the subject.
Founded in September 2011 and lunched on to the World Wide Web through a Press Release, the site has software programs that automatically mine the internet and provide the latest news and literature on 3D-ICs.
3D-ICs.com, dubbed the “Google News of 3D” by its organizers, uses sophisticated software algorithms to search and list the best news, blogs and publications related to the field. All aspects of 3D-ICs are covered, including process technologies, design and architecture issues, packaging as well as industry news. Links are provided to news and blog posts appearing in the popular press as well as in industry portals such as EE Times, Solid State Technology, EDN, Chip Scale Review, FabTech and Future-Fab International.

Subjects

3D Packaging and TSV Monolithic 3D.

External links

3D IC Community
3D InCites
3D IC Alliance

Iulia2020 (talk) 10:01, 6 October 2011 (UTC)

So what about it? Looks like someone's promotional web page? Perhaps might contain some relevant info but of course woul need to be rephrased out of marketing-speak. W Nowicki (talk) 22:42, 11 November 2011 (UTC)

Related to "Tri-Gate Transistor Technology"?

Intel demonstrated 3D transistors in 2011, and is ramping up production for shipment in 2012. See press material. An integrated circuit made from these could be called 3D IC, but one could also argue for a separate article on that since this seems more on the vague research projects stacking 2D transistors. Any opinions? W Nowicki (talk) 22:42, 11 November 2011 (UTC)

3D Transistors (Tri-gate) and 3D ICs are two different technologies that use different manufacturing and assembly processes to manufacture. Therefore it is my opinion that they should have separate pages. The only similarity between the two is that they use the Z-dimension to increase density. 3D transistors, also called [[1]] (see multigate device) involve changing the structure of individual transistors, while 3D ICs involve stacking ultra-thin chips and interconnecting them using through-silicon vias (TSVs), for increased density, improved performance and lower power. --Q3D 21:17, 30 December 2014 (UTC)

Is this related to 3DS (die stacking)?

I am wondering if it might be appropriate to merge 3DS (die stacking) into this article. I am by no means an expert on the subject, and in fact only discovered it today while correcting grammar. After a quick google search I discovered the two may in fact be related. The quality of the 3DS article is poor, as an understatement, so should it be left as a free standing article and linked to, merged with this one, or deleted? Excuse my question if it appears redundant, I am not very experienced at this. (I'm just a member of the typo team, please don't burn me!!!) MyFriendsCallMeSpellcheck (talk) 04:38, 12 December 2011 (UTC)

Yes, they are related. The two should be merged. Dxkb (talk) 03:34, 27 July 2012 (UTC)

 Done. I also agree they are similar enough that one article can cover them, so I merged them. --DavidCary (talk) 21:19, 9 February 2013 (UTC)

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Photo

Would be nice to have a simple illustration. Something like [2] may suffice. Nemo 17:21, 3 March 2017 (UTC)

3D bedazzlement

All the non-volatile memory chips are now layering in the third dimension. 3D is everywhere.

There's no way to tell from the present page title (three-dimensional integrated circuit) that this isn't what this page is about.

I propose instead "3D integrated circuit integration". I saw some variant of this used on a published paper.

This technique is just as much about a new integration technology as it is about the third dimension.

I would even suggest that "vertical integrated circuit integration" would be a fine page title (3D was only used in the first place because it appeals to an enthusiast consumer set—some of whom are professional engineers—who would rather be wearing bulky VR helmets than living their own lives).

For my own wiki, I've just chosen "vertical IC integration" with redirects from a few prosaic variants. — MaxEnt 16:21, 25 November 2017 (UTC)

Intel Accelerates Process and Packaging Innovations

Here are part of an article about 3D silicon fabrication technique at Intel Accelerates Process and Packaging Innovations. Rjluna2 (talk) 17:13, 28 July 2021 (UTC)